Microsoft AR/VR Job | Technical Program Manager- Hardware
Job（岗位）: Technical Program Manager- Hardware
Type（岗位类型）: Program Management
Citys（岗位城市）: Mountain View/United States
Date（发布日期）: 2024-10-11
Summary（岗位介绍）
In Mixed Reality, people—not devices—are at the center of everything we do. Our tech moves beyond screens and pixels, creating a new reality aimed at bringing us closer together—whether that’s scientists “meeting” on the surface of a virtual Mars or some yet undreamt-of possibility. To get there, we’re incorporating groundbreaking technologies, from the revolutionary Holographic Processing Unit to computer vision, machine learning, human-computer interaction and more.
If you are passionate about groundbreaking Mixed Reality technology across a variety of form factors, and want to work on a team dedicated to a culture of inclusion, growth mindset and collaboration, we need you!
The Electrical Engineering Technical Program Management team is looking for an enthusiastic and self-driven Technical Program Manager - Hardware to join our hardware technical program management team and play a critical role in supporting new electrical hardware product development.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively impact our culture every day.
Qualifications（岗位要求）
Required/Minimum Qualifications
- Bachelor's Degree AND 2+ years' experience in engineering, product/technical program management, data analysis, or product development
- OR equivalent experience.
- 2+ years' experience and thorough knowledge of both rigid and flex Printed Circuit Boards (PCB) technologies and PCB assembly processes.
- 1+ year(s) experience managing cross-functional and/or cross-team projects.
- 1+ year experience and basic understanding of design and manufacturing of electrical and mechanical systems.
Other Requirements
Candidates must be able to meet Microsoft, customer and/or government security screening requirements that are required for this role. These requirements include, but are not limited to the following specialized security screenings:
- Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
- Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations.As a condition of employment, the successful candidate will be required to provide proof of citizenship, U.S. permanent residency, or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable."
Additional or Preferred Qualifications
- Bachelor's Degree AND 4+ years' experience in engineering, product/technical program management, data analysis, or product development
- OR equivalent experience.
- 4+ years' experience managing cross-functional and/or cross-team projects.
- 1+ year(s) experience reading and/or writing code (e.g., sample documentation, product demos)
- Familiarity with PCB assembly Surface Mount Technology (SMT) and post assembly processes such as functional testing, edge bonding of components and application of thermal interface materials (TIM).
- Demonstrated ability to identify problem areas, drive issues to closure and ensure solid root cause understanding. Ability to define problems, distill data, establish facts and draw conclusions.
- Demonstrated ability to engage in complex issues and tradeoffs to development partners and management.
Technical Program Management IC3 - The typical base pay range for this role across the U.S. is USD $98,300 - $193,200 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $127,200 - $208,800 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
Microsoft will accept applications for the role until October 25, 2024
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.
Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.
Description（岗位职责）
- Oversee the management of supplier engagements for both rigid and flexible Printed Circuit Boards (PCBs), from initial supplier selection, Statement of Work (SOW) creation, and ensuring the timely delivery of boards within the scheduled timeframe and budget forecast.
- Work closely within Electrical Engineers (EE) to define printed circuit boards technologies and stack ups
- Collaborate with Mechanical, Reliability, and Validation partner teams, to ensure robust design that meets product requirements
- Communicate complex issues and trade-offs to development partners
- Support Configuration Management of hardware components, including BOMs through Product Data Management (PDM) system
- Identify risks associated with program build plan and define mitigation plans
- Be willing and able to travel (domestic and international) to support design and manufacturing activities
- Valued contributor with broader program teamto ensure successful communication and delivery of requirements
- Reports directly to the EE Technical Program Manager (TPM) Lead Director
- Embody our culture and values
