Meta AR/VR Job | RF Module Engineer | Quest
Job（岗位）: RF Module Engineer | Quest
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2024-5-24
Summary（岗位介绍）
As an RF Module Engineer at Meta Reality Labs, you will develop RF modules/SIP (system in package) for Meta’s Augmented Reality (AR) products. You will work closely with product design, electrical and firmware engineers on advancing the state of AR through research and development, prototyping, and implementation in shipping products. You will own end-to-end RF module design from initial definition through production. You should have deep experience in RF module development, SIP and RF advanced packaging for consumer electronics along with a passion for exploration and experimentation.
Qualifications（岗位要求）
BSEE or BSc in related engineering discipline, or equivalent experience
5+ years of relevant industry experience in wireless consumer electronics or similar industries
Experience with advanced packaging technologies and RF module/SIP design
Experience in RF schematic, layout and DFM
Work experience with RF lab equipment for device characterization, debug and component/system performance validation
Experience using circuit, EM, thermal simulation tools such as Ansys HFSS and Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm
Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers, communication testers, spectrum analyzers, oscilloscope)
Description（岗位职责）
Own end-to-end RF module/SIP development for Meta products from concept to mass production
Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development and perform cost/technology/performance analysis
Develop module architecture, schematic, layout and work with vendors for DFM and manufacturing
Perform simulation (RF circuit simulation, 3D EM Simulation and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, validation RF modules/SIPs
Design, simulate and validate advanced RF packaging/module/SIP
Collaborate closely with cross-functional teams and vendors to ensure RF performance are met at component, board and system level
Evaluate new advanced packaging technology, including design and validate prototypes
Domestic/international travel to achieve program milestones
Additional Requirements（额外要求）
MS or PhD in EE with emphasis on advanced packaging or RF design
3+ years of experience in developing RF modules/SIPs, preferably in wireless consumer electronics or similar industries
Experience in RF design and RF advanced packaging technologies
Experience with WiFi, BT, GPS and Cellular RF implementation
Experience in bringing RF modules/SIPs to production
Familiar with regulatory requirements (FCC, CE, etc.)
