Meta AR/VR Job | Advanced Packaging Research Engineer | Oculus

Job(岗位): Advanced Packaging Research Engineer | Oculus

Type(岗位类型): Engineering | Hardware, Research

Citys(岗位城市): Redmond, WA

Date(发布日期): 2022-3-15

Summary(岗位介绍)

At Reality Labs Research (RL-R), our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented, and mixed reality experiences. We are seeking a skilled and motivated Research Scientist to join our team, whose mission is to innovate on tools, platforms and models to help accelerate and de-risk the development of future soft wearable technologies. We are specifically looking for a candidate with experience in advanced packaging research with experience in detailed packaging design, materials characterization, process engineering, prototyping and managing partnerships for scaling to high volume manufacturing. You will collaborate with a diverse and highly interdisciplinary team of exceptional researchers and engineers and will have access to cutting edge technology, resources, and testing facilities. We seek people who work well on teams, can brainstorm and communicate big ideas, and can plan and drive development and research investigations.

Qualifications(岗位要求)

B.S. or equivalent degree in the field of Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Material Science, or related field

5+ years experience with advanced packaging, flexible printed circuit (FPC), printed circuit board assembly (PCBA), 2.5D/3D integration and/or related technologies, preferably in consumer, wearable, or ruggedized electronics

2+ years of experience with handling and integration of thinned components, surface mount technologies (SMT), and back end of line (BEOL) technologies including: thinning, dicing, soldering, eutectic bonding, metal finishing/electrochemical deposition, through silicon via (TSV), flip-chip, wire/die bonding, ball/stud bumping, underfill, over molding and/or other encapsulation methods

Demonstrated successful outcomes in innovating and maturing hardware research, instrumentation, and characterization methods, electrical layout, mechanical design, and data analysis or related areas

2+ years of experience in development and use of high performance electronic materials

Description(岗位职责)

Innovate packaging solutions for high-density heterogeneous and flexible/stretchable integration of electronic components and devices

Design and oversee internal, external, and hybrid manufacturing workflows

Contribute to new technologies and new methods innovation to close critical gaps

Design experiments for development, evaluation, and yield enhancement of processes, devices, and prototypes

Partner and collaborate with researchers, hardware engineers, device and systems integration teams, and external partners

Additional Requirements(额外要求)

Advanced degree in the field of Mechanical Engineering, Electrical Engineering, Aerospace Engineering, Chemical Engineering, Applied Physics, Material Science, or related field

Experience in the domain of advanced packaging including FPC, MCM, SiP, 2.5D/3D integration or Flexible Hybrid Electronics (FHE), or similar technologies

Working experience with reliability testing and failure analysis tools including die/ball shear/wire pull testing, X-ray, C-SAM, thermal cycling and other environmental testing

2+ years of experience with wearable technologies and technical soft goods

Practical experience in hermetic/MEMS packaging processes, thermal management/materials, and injection/transfer molding

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