Meta AR/VR Job | Research Scientist Intern, SWT, Integration and Manufacturing (PhD)

Job(岗位): Research Scientist Intern, SWT, Integration and Manufacturing (PhD)

Type(岗位类型): Hardware | Research

Citys(岗位城市): Redmond, WA

Date(发布日期): 2022-12-22


The RL Research Team at Meta pioneers research into new technologies to solve most challenging engineering problems for next generation AR, VR, and MR products.

We are developing next generation XR interfaces that are essential to enable the Metaverse. These devices need to be soft and conformable to provide seamless user experiences, yet require high-density integration of high-performance electronics to enable all the essential functions in a wearable form factor. The Soft Wearable Technologies (SWT) team brings together a world-class team of researchers, developers and engineers to address the integration and manufacturing challenges to create the future of XR interactions, which together will become as universal and essential as smartphones and personal computers are today.


Currently has, or is in the process of obtaining, a PhD degree in the field of Physics, Materials Science, Mechanical Engineering, Electrical Engineering, or related fields.

2+ years experience working in cleanroom environments, and sound knowledge of micro/nano-fabrication and semiconductor devices.

Experience in developing and optimizing processes, lithography, physical/chemical vapor deposition, dry and wet etching, metrology.

Interpersonal experience: cross-group and cross-culture collaboration.

Must obtain work authorization in the country of employment at the time of hire and maintain ongoing work authorization during employment.


Research and develop next-generation flexible/stretchable hybrid electronics that feature both mechanical conformality and high-density integration.

Device design and fabrication of low-profile thin-film devices (such as thin-film transistors, sensors, and actuators).

Perform device characterization and data analysis to inform device design/fabrication iterations.

Statistical data management and analysis to inform fabrication infrastructure build.

Collaborate with the cross-functional research team, present and share results with key stakeholders.

The work should be publishable research results in top-tier journals and at leading international conferences in materials science.

Additional Requirements(额外要求)

Research experience with flexible and/or stretchable electronics, or thin-film transistors.

Sound understanding of device physics, process integration and device fabrication.

Experiences in device or circuit design or simulation using standard EAD/layout tools.

Experience in troubleshooting, DOE and SPC tools.

Proven track record of achieving significant results as demonstrated by first-authored publications.

Intent to return to degree-program after the completion of the internship/co-op.