Meta AR/VR Job | Depth Sensing Tech Lead
Job（岗位）: Depth Sensing Tech Lead
Type（岗位类型）: Hardware
Citys（岗位城市）: Remote, US | Sunnyvale, CA | Redmond, WA
Date（发布日期）: 2022-9-7
Summary（岗位介绍）
Reality Labs at Meta is a world leader in the design of virtual reality (VR) and augmented reality (AR) systems. Come work alongside technology visionaries and research scientists to create the technology that makes VR and AR pervasive and universal. The Cameras & Depth (C&D) team gathers world class expertise and talent in photographic and machine vision cameras, imaging sensors, and depth, inertial, and bio sensing systems, and owns the development and validation for all these sensing systems across the whole AR, VR, & Portal product portfolios.
As a tech lead for technology incubation on the depth architecture team, you will own and drive next-generation technologies from initial concept, early system prototyping, and experiential validation. A successful candidate will have a passion for exploring and defining innovative designs at the forefront of custom sensing technology, to enable breakthrough new 3D sensing architectures delivering the best-in-class performance in small form factors and ultra-low power systems. The ideal candidate is enthusiastic about exploring and tackling challenges associated with chipset architecture and integration, adding clarity to sometimes ambiguous technical problems, is engaged in deep collaboration across internal and external teams of passionate technologists that result in detailed depth sensor analyses, critical tradeoff evaluations, and sensor architectural execution strategies.
The scope of this role in the depth sensing architecture team will focus on researching, creating, specifying, and developing depth sensing technology to achieve high-end performance in very constrained area and power efficiency requirements in the AR and VR space.
Qualifications（岗位要求）
BS in Electrical, Computer Engineering or related experience
6+ years of experience engineering consumer products (concept through mass production)
Experience working with camera systems or sub-systems
Experience with critical depth system requirements, from core architecture through to individual components
Experience in circuit simulation and modeling
Experience in at least one of the following areas in depth sensing: (1) laser drivers & VCSEL definition/interaction, (2) image sensor architectures, (3) depth module HW design & system integration
Description（岗位职责）
Own and lead next-generation technologies from initial concept, early system prototyping, and experiential validation
Explore, propose, and create innovative high-performance depth system architecture proposals within stringent area and power efficiency constraints, targeting Meta’s leading-edge AR and VR devices
Carry out systems design and modeling to meet system requirements
Run simulations to predict system performance and power, and validate system tradeoffs
Lead the drafting of SOWs, selection of strategic prototyping partners with a path toward productization, and consult and participate in small-scale prototype builds for internal proof of experience testing and validation
Draft and own detailed specification documentation for internal and external partners
Lead and participate in deep technical weekly reviews with key external design partners, from top level architecture, critical blocks, functional models, and low level implementation
Collaborate with internal and external partners to prototype and validate the designs towards size, weight, cost, and performance targets
Travel both domestically and internationally up to 20% of the time
Additional Requirements（额外要求）
3+ years of experience with high speed laser drivers for time of flight and other active depth sensing systems
Deep understanding of mixed-signal building blocks (ADCs, DACs, output drivers)
Basic understanding of illumination sources such as VCSELs, LEDs, and/or edge emitting lasers plus interaction with system and RX/TX components
Experience in designing, modeling, prototyping, characterization of critical optical components and sub-system for depth sensing applications
Experience transferring technology from research into a shipping product
