Meta AR/VR Job | Depth Sensor Validation Engineer
Job（岗位）: Depth Sensor Validation Engineer
Type（岗位类型）: Engineering, Hardware
Citys（岗位城市）: Sunnyvale, CA
Redmond, WA
Date（发布日期）: Before 2021-12-14
Summary（岗位介绍）
We are looking for a Depth Sensor Validation Engineer that will partner with a team of professionals covering the complete CMOS depth sensor lifecycle. This individual will lead the validation requirements definition, and validate leading edge depth sensors into our depth modules. Their work scope will span Off-the-Shelf sensors, semi-custom sensors, fully custom sensors, and advanced sensor technologies.
Qualifications（岗位要求）
MS in Physics, Electrical Engineering, or a related technical discipline.
3+ years of experience in-depth sensor validation including iToF, Active stereo and other sensing modalities, review and author formal validation plan and report.
Experience working with VCSELS, LEDs and Diffractive Optical Elements.
Proficiency with data collection and analysis tools, including C/C++, Python, MATLAB, and other scripting languages to implement calibration methodologies.
Experience with sensor electrical and functional validation tools, including interface (I2C/I3C/C-PHY/D-PHY MIPI interfaces) and power supply.
Analytical skills. Experience drawing conclusions from complex dataset and present at a high level to drive architecture decisions.
Experience communicating cross-functionally and drive external design house/suppliers.
Description（岗位职责）
Drive and develop methodologies for validation of depth sensors and systems, including simulations and sensor hardware evaluation.
Lead technical efforts to bring up and validate the off the shelf and innovative customized depth sensors.
Interact with sensor vendors to understand performance of different technologies and identify vendors that meet internal requirements through validation.
Prototype innovative concepts to define and validate the new features using FPGA and emulation.
Collaborate with depth chip design team, computer vision scientists, depth system team (module/optical/illumination/architects) to develop next generation sensor technologies using radiometric models and simulations.
Additional Requirements（额外要求）
Experience with various depth iToF and dToF sensors and systems.
Experience with depth modules and system components for high volume manufacturing.
Familiar with CMOS image process, depth performance analysis, imaging algorithms.
Understanding of Machine learning models and FPGA implementation of the models for different tracking applications.
Experience on FPGA integration and bringing up depth processing pipelines.
Experience in silicon design (Verilog, firmware).
