Meta AR/VR Job | Si Package Development Engineer 2.5D/3D | Oculus

Job(岗位): Si Package Development Engineer 2.5D/3D | Oculus

Type(岗位类型): Design | Engineering, Hardware

Citys(岗位城市): Sunnyvale, CA | Redmond, WA | Austin, TX | Remote, US

Date(发布日期): 2022-1-19

Summary(岗位介绍)

Reality Labs focuses on delivering Facebook’s vision through Augmented Reality (AR) and Virtual Reality (VR). The compute performance and power efficiency requirements of Virtual and Augmented Reality require custom silicon. Facebook Silicon team is driving the state of the art forward with breakthrough work in computer vision, machine learning, mixed reality, graphics, displays, sensors, and new ways to map the human body. Our chips will enable AR and VR devices where our real and virtual world will mix and match throughout the day. We believe the only way to achieve our goals is to look at the entire stack, from transistor, through architecture, to firmware and algorithms. Join the adventure of a lifetime as we make science fiction real and change the world.

We are seeking a Silicon Package Development Engineer to join our silicon team. We are building a competency in Packaging technology to support the development of custom silicon for AR/VR hardware as well as to develop Packaging solutions that are optimal for our device ID and system level performance.

Qualifications(岗位要求)

5+ years of experience in advanced silicon packaging or similar disciplines

Hands-on design, architecture or development experience in 3D stacking technologies like TSV and hybrid bonding with application to a product

Currently has, or is in the process of obtaining a Bachelor’s degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience. Degree must be completed prior to joining Meta.

Description(岗位职责)

Develop advanced packaging solutions for Facebook custom silicon involving 2.5D and 3D stacking technologies suitable for consumer hardware products – applications could include novel ways of integrating SoC and Memory or other functions.

Work closely and cross-functionally with internal silicon, architecture, and system teams and externally engaged partners, design houses and OSAT’s to support architecture, performance and form factor requirements for the product.

Additional Requirements(额外要求)

Master’s or PhD degree in engineering

Experience and track record to take products from concept to prototyping and production

Experience with package design tools, SI/PI and finite element modeling methodology

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