Apple AR/VR Job | Thermal Engineer
Job（岗位）: Thermal Engineer
Citys（岗位城市）: Cupertino, California, United States
Date（发布日期）: 2025-2-25
Summary（岗位介绍）
We are seeking an entry level Thermal Engineer to support the design, development, and validation of thermal solutions for silicon validation systems. This role will also provide thermal-design support to other engineering teams at Apple.
Working with multi-functional teams to ensure successful system integration
Performing thermal analysis to identify effective cooling solutions
Design validation and characterization from prototype bring-up to product testing
Conducting thermal testing, process temperature, and power data to assess and validate cooling solutions
Participating in the investigation of new technologies and proof-of-concept experiments
Driving failure analysis and design of experiments (DOEs) to implement corrective actions and design improvements.
Qualifications（岗位要求）
B.S. in Mechanical Engineering focus on thermal analysis and testing in electronics with 0 years of experience.
Description（岗位职责）
Thermal engineer will lead the end-to-end thermal solutions for Silicon validation, with responsibilities including:
- Defining thermal requirements and creating technical specifications
- Working with multi-functional teams to ensure successful system integration
- Lead external partners and projects to ensure interoperability of internal and external components and timely project completion
- Performing thermal analysis to identify effective cooling solutions
- Design validation and characterization from prototype bring-up to product testing
- Conducting thermal testing, process temperature, and power data to assess and validate cooling solutions
- Participating in the investigation of new technologies and proof-of-concept experiments
- Driving failure analysis and design of experiments (DOEs) to implement corrective actions and design improvements.
Additional Requirements（额外要求）
Internship experience designing, simulation, and validating thermal design for high-powered Silicon devices
Good understanding of key thermal technologies including heat sinks, heat pipe, vapor chamber, TIM materials, fans, Chiller and thermoelectric heaters
Direct experience in CFD analysis and use of software: Icepak, Flotherm
Understanding of PCB thermal modeling and Background in SOC, flip chip, PMIC thermal
Excellent written and verbal communication skills and people skills; ability to interact with management, team members and external vendors
Hands-on experience in thermal analysis and testing for electronic products or modules in college or industries
Experience with testing and lab equipment, TTVs, Thermocouples, IR Camera, Stroboscopes, DAQ and wind tunnel testing, and thermal measurements
Mechanical Design experience with CAD software: NX 3D CAD tool & Team Center
Teamwork: the candidate must be able to communicate well with cross-functional team members, be able to efficiently collaborate with team members to achieve project goals, and contribute positively to the engineering community.
M.S. or PhD in Mechanical Engineering with a focus on Heat Transfer or electronics cooling.
