Meta AR/VR Job | AR System Integration Electrical Engineer
Job（岗位）: AR System Integration Electrical Engineer
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2024-3-23
Summary（岗位介绍）
As an Integration Electrical Engineer at Reality Labs, you will help to create the next generation of Augmented Reality (AR) platforms. The ideal candidate should have demonstrated the ability to collaborate with internal design teams and external production partners. More so, we are seeking experienced engineers that have demonstrated success navigating through the development and execution of end-to-end manufacturing processes in support of complex miniaturized systems (opto-mechanical products, display, battery operated, high speed interfaces,...).Successful candidate should have the ability to intricately relate the different PCB/Flex/RFPC/ rules to specific stages in the manufacturing process. Proficiency in deciphering how design choices impact fabrication, assembly, and electrical performance is crucial. This engineer should be adept at recognizing the nuanced interplay between design decisions and their implications for manufacturability, yield, and overall product quality. The capacity to navigate trade-offs becomes essential, allowing them to push the envelope on design rules strategically, especially when pursuing miniaturization goals. This includes the ability to balance the constraints imposed by design guidelines with innovative solutions to optimize manufacturing processes without compromising the integrity and reliability of the final product.The candidate will also have a strong ability to communicate to all levels of an organization – from management and higher-level strategy planning to the technicians and leads on a manufacturing floor.
Qualifications（岗位要求）
Demonstrated experience in working with Flexible Printed Circuits (FPC) and Rigid-Flexible Printed Circuits (RFPC), including their design, stacking, and manufacturing processes.
Proven experience to understand and apply FPC and RFPC technologies in various applications, contributing to the overall product design and development. Skilled in optimizing FPC and RFPC stacking processes to enhance product performance and miniaturization.
Familiarity with the properties and high-volume manufacturing engineering process involving printed circuit board assembly (Board fabrication, SMT, Through-Hole, Pin-in-Paste), rigid flexible printed circuits (RFPC), flexible printed circuits (FPC), SIP(System In Package) and mechanical systems integration within a concurrent environment.
Assist designers and electrical engineers developing sophisticated material stack-ups using PCB Industry CAD models. Develop novel material or design concepts to achieve product design goals while driving technology development efforts at FPC suppliers to achieve product design goals.
Proficient in collaborating with cross-functional teams to integrate FPC and RFPC technologies into product designs and manufacturing operations.
Bachelor of Science (BSE) in Electrical Engineering or equivalent experience.
5+ years of industry experience designing complex/miniaturized board designs (PCB/FPC/RFPC) and experience working closely with fabrication and assembly vendors to build respective designs.
Description（岗位职责）
Partner with internal hardware design teams from the earliest of conceptual stages to the development of high fidelity prototypes, with a line-of-sight to mass production.
Influence product design decisions and work closely with our operations team in scaling our manufacturing builds with a focus on miniaturization, quality and reliability.
Investigate, develop, and evaluate new cutting-edge material and processes to meet project requirements.
Function as an expert in system integration, across all design for excellence (DFx) areas, advising mechanical, electrical, and optical design engineers in implementing design for assembly and manufacturability into their designs.
Bridge the space between one-off product engineering prototypes and high volume manufacturing operations.
Collaborate cross functionally within the engineering community to solve difficult problems and implement meaningful solutions.
Willingness to travel both domestically and internationally.
Additional Requirements（额外要求）
Masters of Science (MSE) in Electrical or equivalent engineering discipline.
Product experience across mobile, wrist, AR and/or miniaturized computing.
Silicon packaging experience (SiP, PoP) - defining, designing, and understanding the manufacturing processes involved to fabricate and validate the custom package.
Experience partnering with domestic and overseas manufacturing partners to create processes to assemble consumer products, in mass production settings.
Experience with product-level failure mode investigation and analysis techniques (Dye and Pry, Cross section, Xray) as well as experience correlating given failure modes to specific process, material and design related stressors.
Experience with common PCB CAD layout and DFM software (Cadence/Valor) and industry standards (IPC, JEDEC, IEEE, EIA, etc.).
Experience with design for six sigma, inclusive of structure problem solving approach, design experimentation and optimization (DOE), root cause and defect/failure analysis, FMEA, FEA, reliability testing, statistical data analysis, manufacturing process knowledge (MSA/GRR).
Experience with 3D design tools (NX), FEA, and other CAD suites.
Experience in software-aided DFM validation for PCB fabrication and Assembly using Valor NPI and navigating Cadence Allegro Layout environment for design & data review and with Geometric Dimensioning and Tolerancing (GD&T) and 2D/3D tolerance analyses.
Communication skills with the experience to distill down highly technical topics into clear and concise messaging to cross-functional teams.
