Microsoft AR/VR Job | Principal Engineer, IC Package Pathfinding
Job（岗位）: Principal Engineer, IC Package Pathfinding
Type（岗位类型）: Hardware Engineering
Citys（岗位城市）: Austin, United States | Portland, United States | Mountain View, United States
Date（发布日期）: 2021-12-6
Summary（岗位介绍）
The silicon computing development team is seeking passionate, driven, and intellectually curious computer/electrical engineers to deliver premium-quality designs once considered impossible. Our team is involved in numerous projects within Microsoft developing custom silicon for a diverse set of systems ranging from traditional computing solutions to artificial intelligence and augmented reality. We are responsible for delivering cutting-edge, custom CPU and SoC designs that can perform complex and high-performance functions in an extremely efficient manner.
Qualifications（岗位要求）
- Bachelor’s degree in Materials Engineering, Mechanical Engineering, Electrical Engineering, or other semiconductor packaging related discipline
- 15 years of experience in semiconductor packaging development and/or manufacturing
- 5 years specific experience in 2.5D / 3D IC Package architecture, design, or development
Preferred Qualifications:
- Hands on experience in package manufacturing and/or test environment
- Experience in supply chain technical/quality management
- Record of success in cross-functional team environment
- Detailed understanding of package manufacturing flows and processes
- Strong presentation and communication skills
- Understanding of semiconductor device reliability, with experience in physical failure analysis
- Specific experience with MCM/chiplet package technologies
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.
Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.
Description（岗位职责）
The Package Engineering function provides support, expertise and insight to the Si device development team through the entire life cycle of the product. The Pathfinding position primarily involves discovery and evaluation of novel package technologies, delivering the ability to assess and select between competing package solutions for leading edge custom silicon devices. Additionally, support will extend into early device design, supplier selection, and technology qualification to prepare for live product introduction.
This position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies, as well as experience managing qualification and introduction to manufacturing of advanced semiconductor package technology. Candidate should possess specific experience in one or more of the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. In addition, experience in physical failure analysis, subcontract supplier management, and package manufacturing exposure is strongly preferred.
