Meta AR/VR Job | Thermal Research Engineer

Job(岗位): Thermal Research Engineer

Type(岗位类型): Engineering

Citys(岗位城市): Redmond, WA

Date(发布日期): 2023-10-23

Summary(岗位介绍)

At Reality Labs Research (RL-R), our goal is to explore, innovate and design novel interfaces and hardware subsystems for the next generation of virtual, augmented, and mixed reality experiences.

We are looking for a skilled and motivated Thermal Research Engineer to join our team. We are specifically seeking a candidate to lead projects to develop thermal management solutions for next generation XR devices, from concept to advanced prototypes suitable for product integration. Key responsibilities include defining and driving a thermal management research direction, leading research and development projects, including engagements with academic and industrial research and manufacturing partners, and performing thermal modeling and analysis using FEA and CFD tools. The chosen candidate will work with a diverse and highly interdisciplinary team of researchers and engineers and will have access to innovative technology, resources, and testing facilities.

Qualifications(岗位要求)

BS degree in Physics, Aerospace Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or similar discipline, relevant technical field, or equivalent practical experience

3+ years experience with project leadership in a research or advanced product development environment

5+ years experience with FEA, CFD (COMSOL, ANSYS, FloEFD) and CAD (Solidworks, CREO, NX) or similar tools

5+ years experience with system and/or sub-system thermal simulation, analysis, and solution development, from concept to production, for high volume consumer electronics devices

Experience with rapid prototyping and high-volume manufacturing method

Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment

Description(岗位职责)

Define and drive a thermal management research direction

lead a team of researchers and engineers to develop novel thermal management solutions for next generation XR devices, from concept to advanced prototypes

Develop relationships, scope and lead engagements with academic and industrial research and manufacturing partners

Develop thermal FEA and CFD models and run simulations using Ansys, COMSOL, or similar software

Interpret simulation results and provide physical explanations and possible solutions to problems

Develop thermal test beds, data acquisition systems, and processes to characterize thermal management materials, devices, and systems

Run experiments, analyze data, document results, and present conclusions and recommendations in research meetings.

Recommend design changes/directions to meet device performance requirements, participate in team brainstorming and new technology development

Additional Requirements(额外要求)

MS/PhD in Physics, Aerospace Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or similar discipline

Experience with thermal design of printed circuit boards, flex circuits, thermal interface materials, digital chips/device, heatsinks and other active/passive cooling solutions

Experience developing passive thermal management solutions using compliant materials such as aerogels, graphite heat spreaders, phase change materials, metamaterials, radiation coatings

Experience developing relationships, scoping and lead engagements with academic and industrial research and manufacturing partners (OEMs, CMs)

Experience with bioheat transfer (e.g., Pennes Bio-Heat equation) and thermal management for wearables, including moisture/humidity simulation and analysis

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