Meta AR/VR Job | AR Integration Electrical Engineer

Job（岗位）: AR Integration Electrical Engineer

Type（岗位类型）: Hardware

Citys（岗位城市）: Redmond, WA

Date（发布日期）: 2023-8-10

Summary（岗位介绍）

As an Electrical Integration Engineer at Reality Labs, you will help to create the next generation of Augmented Reality (AR) platforms.

The ideal candidate should have demonstrated the ability to collaborate with internal design teams and external production partners. More so, we are seeking experienced engineers that have demonstrated success navigating through the development and execution of end-to-end manufacturing processes in support of complex miniaturized systems (opto-mechanical products, display, battery operated, high speed interfaces,...). The candidate will also have a strong ability to communicate to all levels of an organization – from management and higher-level strategy planning to the technicians and leads on a manufacturing floor.

Qualifications（岗位要求）

Bachelor of Science in Electrical or Mechanical Engineering, or equivalent experience.

Communication skills with the experience to distill down highly technical topics into clear and concise messaging to cross-functional teams.

Experience with product-level failure mode investigation and analysis techniques (Dye and Pry, Cross section, Xray) as well as experience correlating given failure modes to specific process, material and design related stressors.

5+ years of industry experience directly contributing to product development or high-volume manufacturing process engineering involving printed circuit board assembly (Board Fab, FATP, SMT, through-hole, pin-in-paste), rigid flexible printed circuits (RFPC), flexible printed circuits (FPC), and mechanical systems integration within a concurrent environment. Experience designing, developing, and bringing-up various high-precision interconnect technologies processes (Hot Bar, ACF, Laser Soldering) to enable miniaturized applications.

Experience with printed circuit board layout and fabrication experience/knowledge, and with PCB CAD layout and/or viewing software.

Experience with industry standards (IPC, JEDEC, IEEE, EIA, etc.).

Experience with Geometric Dimensioning and Tolerancing (GD&T) and 2D/3D tolerance analyses.

Experience partnering with domestic and overseas manufacturing partners to create processes to assemble consumer products, in mass production settings.

Experience in product/process characterization using techniques such as FEA, strain analysis, cost modeling, yield and defect data analysis.

Description（岗位职责）

Partner with internal hardware design teams from the earliest of conceptual stages to the development of high fidelity prototypes, with a line-of-sight to mass production.

Influence product design decisions and own a substantial aspect of our scaled manufacturing builds with a focus on miniaturization, quality and reliability.

Investigate, develop and evaluate new cutting-edge material and processes to meet project requirements.

Function as an expert in system integration, across all design for excellence (DFx) areas, advising mechanical, electrical, and optical design engineers in implementing design for assembly and manufacturability into their designs.

Bridge the space between one-off product engineering prototypes and high volume manufacturing operations.

Collaborate cross functionally within the engineering community to solve difficult problems and implement meaningful solutions.

Willingness to travel both domestically and internationally.

Additional Requirements（额外要求）

Experience in software-aided DFM validation for PCB fabrication and Assembly using Valor NPI and navigating Cadence Allegro Layout environment for design & data review.

Masters of Science in Electrical or Mechanical Engineering or equivalent engineering discipline.

Product experience across mobile, wrist, AR and/or miniaturized computing.

Experience with statistical analysis, including usage of tools such as JMP and Minitab, major plus if there is exposure to script in Python, Perl, or VB Script a plus.

Experience in defining and understanding package footprint characteristics and their impact on the solderability of SiP (System-in-Package) substrate design, fabrication, and assembly experience.

Experience with design for six sigma, inclusive of structure problem solving approach, design experimentation and optimization (DOE), root cause and defect/failure analysis, FMEA, FEA, reliability testing, statistical data analysis, manufacturing process knowledge (MSA/GRR).

Experience with electro-mechanical design, material selection, design for EMI/RF, antenna design and system integration.

Experience with 3D design tools (NX), FEA, and other CAD suites.

Experience with mechanical tolerance analysis and tools such as CETOL and VSA.

Experience working with reliability and/or quality engineering.

Experience with industry consortiums such as IPC and iNEMI.

Experience with high speed automation, mechanized assembly, and testing for high volume products.