Meta AR/VR Job | Lead Camera and Depth Electrical Engineer
Job（岗位）: Lead Camera and Depth Electrical Engineer
Type（岗位类型）: Engineering
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2023-6-7
Summary（岗位介绍）
The Reality Labs team at Meta is helping more people around the world come together and connect through world-class AR/VR hardware and software. With global teams dedicated to AR/VR research, computer vision, haptics, social interaction, and more, Reality Labs is committed to driving the state-of-the-art forward through relentless innovation. Our Technology Engineering for Devices (TED) team explores, develops, and delivers new cutting-edge technologies that serve as the foundation of current and future AR/VR products. From mixed reality and human interaction to natural inputs and beyond, TED is focused on transforming new technologies from early concept to product by iterating, prototyping, and realizing the human value and new experiences these technologies enable. The potential of AR/VR to change the world is immense and we’re just getting started.
The Camera and Depth HW team within TED develops high-performance Camera and Depth solutions for FRL’s AR/VR products. This multidisciplinary group brings research to life by realizing state-of-the-art custom modules including mixed-signal ASICs, image sensors, lasers, optics, and firmware. We are seeking a Lead Camera & Depth Electrical Engineer for end-to-end ownership of development and productization electrical engineering from early concepts to release to mass production. In this role, you will be responsible for the circuit design, board bring-up, implementation and debug of mixed-signal ASICs and systems used in our solutions. You will experiment with and develop novel solutions to complex electronics problems, working closely with cross-functional partners combining electronics, image sensors, optics, mechanicals, and firmware.
Qualifications（岗位要求）
Experience with system-level design including circuit design, high-speed/RF/signal integrity, PCB layout, system bring-up, integration, and debug.
Masters in Electrical Engineering or relevant equivalent experience.
Experience with analog/digital circuit design and various communications protocols such as I2C, I3C, UART, SPI, USB, MIPI, etc.
Experience with low-power analog circuit design, DC/DC converters, power management methods, A/D and D/A conversion and image sensors.
8+ years end-to-end consumer product life cycle experience.
Experience with schematic capture and PCB design using Cadence OrCAD/Allegro or equivalent.
Experience validating/verifying EE function blocks including Custom ASICs.
Description（岗位职责）
Lead the implementation, failure analysis and debugging of mixed-signal ASICs, board-level circuitry, high-speed/RF/signal integrity and systems used in our solutions.
Develop novel solutions to complex electronics problems and provide technical leadership for our EE team..
Collaborate with the System Electrical Engineering teams on seamless integration of camera and depth modules into Reality Labs’ devices.
Develop design methodologies and best practices for the Camera & Depth EE team.
Implement our PDP methodology in all designs, present and attend design reviews.
Assess vendors and manage outsourced development of custom ASICs and PCBs.
Additional Requirements（额外要求）
Experience with camera or depth sensor electrical design.
PhD in EE or related disciplines.
Experience with laser driver or camera and depth sensor chip architectures.
Experience developing modules or systems in high volume consumer electronic products.
Experience leading an EE team.
Experience partnering with software or firmware teams to define and verify HW design maturity across test cases.
Experience working with JDM, ODM, CM partners.
