Meta AR/VR Job | ASIC Engineer, Physical Design
Job（岗位）: ASIC Engineer, Physical Design
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2023-5-28
Summary（岗位介绍）
Facebook is hiring ASIC Physical Design Engineers within our Infrastructure organization. We are looking for individuals with experience in backend implementation from Netlist to GDSII in low power and high-performance designs to build efficient System on Chip (SoC) and IP for data center applications.
Qualifications（岗位要求）
Bachelor’s degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.
5+ years of experience in interpersonal, teamwork, and communication skills and experience interfacing with cross-functional teams, IP, and EDA vendors.
Experience in physical design and timing closure.
Knowledge of RTL2GDSII flow and design tape-outs in 7nm or below process technologies.
Experience with EDA tools like DC/Genus, Innovus/ICC2, Primetime, Redhawk/Voltus, or Calibre.
Hands-on experience in floor planning, place & route, power and clock distribution, and timing convergence of high-frequency designs.
Knowledge of geometry/process/device technology implications on physical design.
Experience with large SOC designs (>20M gates) with frequencies over 1GHZ.
Programming/scripting skills: TCL, Python, Perl or Shell.
Description（岗位职责）
Develop and own physical design implementation of multi-hierarchy low-power and high-performance designs, including physical-aware logic synthesis, floorplan, place and route, clock tree synthesis, static timing analysis, IR drop, EM, and physical verification in advanced technology nodes.
Resolve design and flow issues related to the physical design, identify potential solutions, and drive execution.
Deliver physical design of an end-to-end IP or integration of ASIC/SoC design and point out lower power and higher performance trade-offs.
Define and implement schemes, including semi-custom placement and routing, to improve performance and power.
Work with the RTL design team to understand partition architecture and drive physical aspects early in the design cycle.
Interface with the RTL design team to drive design modifications to resolve congestion/timing issues and implement functional ECO’s.
Use EDA tool-based programming and scripting techniques to automate and improve throughput and quality.
Interact with tool vendors to drive tool fixes and flow improvements. Perform tool evaluations of new vendor tools and functions.
Additional Requirements（额外要求）
Experience in full chip floor planning, partitioning, budgeting, and power grid planning.
Experience with low power implementation, power gating, multiple voltage rails, UPF/CPF knowledge.
Experience in planning, implementing, and analyzing high-speed clock distribution networks. Experience with alternate strategies for clock distribution, including standard trees, mesh, H-Tree, and clock power reduction techniques.
Knowledge of static timing analysis and concepts, defining timing constraints and exceptions, corners/voltage definitions.
Knowledge of Circuit design, device physics, and deep sub-micron technology.
Experience in the physical design of data-path intensive designs.
Experience in the 3D-IC technology, methodology, and advanced packaging.
Experience in validating Power Distribution Network (PDN), IR/EM, Thermals for 3D-IC.
