Meta AR/VR Job | Research Scientist Intern, Simulation and Validation (PhD)
Type（岗位类型）: Hardware | Research
Citys（岗位城市）: Redmond, WA
The RL Research Team at Meta pioneers research into new technologies to solve most challenging engineering problems for next generation AR, VR, and MR products.
We are developing next generation XR interfaces that are essential to enable the Metaverse. These devices need to be soft and conformable to provide seamless user experiences, yet require high-density integration of high-performance electronics to enable all the essential functions in a wearable form factor. The team brings together a world-class team of researchers, developers and engineers to address the integration and manufacturing challenges to create the future of XR interactions, which together will become as universal and essential as smartphones and personal computers are today.
Currently has, or is in the process of obtaining, a PhD degree in the field of Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or related fields.
2+ years experience working with COMSOL, AutoCAD for stress analysis and simulation.
Sound knowledge of microelectronic packaging , especially in interconnect materials and processes , experience in developing and optimizing processes.
Interpersonal experience: cross-group and cross-culture collaboration.
Must obtain work authorization in the country of employment at the time of hire and maintain ongoing work authorization during employment.
Research and develop next-generation flexible/stretchable hybrid electronics that feature both mechanical conformality and reliable interconnection during flex/stretch.
Device design, simulation and fabrication of low-profile strain relief joint between soft and rigid areas.
Develop the multi-physics model for strain relief and conduct simulation to identify the optimal strain relief joint and materials properties.
Fabricate the prototypes to validate and optimize model simulation.
Perform device characterization and data analysis to inform device design/fabrication iterations.
Collaborate with the cross-functional research team, present and share results with key stakeholders.
The work should be publishable research results in top-tier journals and at leading international conferences in materials science.
Research experience with flexible and/or stretchable electronics.
Sound understanding of device physics, process integration and device fabrication.
Experiences in hands fabrication of microelectronics.
Experience in reliability testing and Failure analysis.
Proven track record of achieving significant results as demonstrated by grants, fellowships, patents, as well as first-authored publications at leading workshops or conferences such as IMPAS, ECTC, Techblink.
Intent to return to degree-program after the completion of the internship/co-op.