Meta AR/VR Job | Module Packaging Engineering Manager

Job(岗位): Module Packaging Engineering Manager

Type(岗位类型): Design | Engineering, Hardware

Citys(岗位城市): Sunnyvale, CA

Date(发布日期): 2022-9-8

Summary(岗位介绍)

Meta’s Reality Labs is developing AR/VR to bring the world closer together. In order to do so, class leading experts in variety of subjects are needed in efforts to ship groundbreaking products at the intersection of hardware, software, and content. We have a clear mandate to ship products at scale. In particular, seemingly impossible products that define new categories that advance Meta’s mission of connecting the world through the Metaverse. The AR/VR Technology Validation Engineering Team has the responsibility for taking breakthroughs in core technology and delivering them to market at scale.

We are looking for managerial candidate who is passionate about manufacturing and is eager to push process envelop beyond impossible limits of today’s module packaging technologies, contributing to the miniaturization of core component modules (Camera, Depth, Biosensing, Wireless and Audio) critical to making AR/VR devices more capable, less intrusive, and more comfortable to wear. This position has a great vantage of being part of Meta’s Metaverse drive, and be one of the engineering leaders that will revolutionized machine to human interface.

Qualifications(岗位要求)

First-hand knowledge of image sensors modules, or wireless modules or biosensor modules or audio modules

Experience in electronics packaging design and/or manufacturing technology

BS in Physics, Photonics, Electrical Engineering, or a related technical discipline

7+ years of industry work experience in photonics, plus 2+ years of people management

Experience supporting timely communication with cross functional partners and internal stakeholders

Description(岗位职责)

Lead and grow a diverse team of experienced manufacturing engineering experts, focusing efforts to miniaturize key module components for AR/VR and wearable devices.

Drive and develop mechanisms and methodologies that align new technology initiatives (NTI) in packaging and process development that meet the design intent needs of new device components manufacturing.

Develop framework, metrics, and dashboards to measure team productivity and cross functional partners and external vendors.

Work closely with cross functional partners (Camera, depth, sensor, audio and wireless teams. System team and TPM) of ongoing AR/VR products development, and lead the team to provide support in scaling module production. Working as an advocate for best practices in platformization to increase efficiency, reduce manufacturing blockers, mitigate risks and ensuring smooth transition of prototype NTI to NPI (new product development) transition.

Support timely communication with cross functional partners and internal stakeholders of potential failures or gaps with mitigating proposals. Manage team internal and cross functional conflict resolution. Work to clarify R&R with peers to ensure effective execution.

Create packaging manufacturing process development future vision and road maps that is well aligned with cross functional team and Meta’s overall goal.

Additional Requirements(额外要求)

Proven communication and analytical skills, including experience identifying and solving ambiguous problems

Experience in wafer level Optoelectronics design or manufacturing

Familiar with electronics packaging and miniaturization of camera, depth, biosensor, wireless and audio modules

Proven people management skills, with experience hiring and growing a team of talented leaders and individuals

MS or PhD in Physics, Photonics, Electrical Engineering, or a related technical discipline

Experience managing suppliers and supplier contracts, budgets, and headcount, and acquiring equipment and licenses

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