Meta AR/VR Job | Analog Mixed Signal Designer/Lead
Job（岗位）: Analog Mixed Signal Designer/Lead
Citys（岗位城市）: Sunnyvale, CA
Facebook Reality Labs is a world leader in the design of virtual reality (VR) and augmented reality (AR) systems. Come work alongside technology visionaries and research scientists to create the technology that makes VR and AR pervasive and universal. The Cameras & Sensors (C&S) team gathers world class expertise and talent in photographic and machine vision cameras, imaging sensors, and depth, inertial, and bio sensing systems, and owns the development and validation for all these sensing systems across the whole AR, VR & Portal product portfolios.
We are looking for a Mixed-signal IC AMS designer and Chip Lead that will partner with a team of professionals covering the complete CMOS sensor lifecycle. This individual will contribute to the development of advanced mixed signal circuits for our semi-custom and fully custom dToF depth sensor.
MS in Physics, Electrical Engineering or a related technical discipline or equivalent experience.
3+ years of experience in industry Analog and Mixed signal designing on CMOS image sensor or ToF sensor.
Knowledge of analog and mixed signal design, simulation, verification methodology and full chip integration at circuit and chip level.
Knowledge of analog/mixed-signal fundamentals (noise, linearity, signal-integrity in mixed-signal systems).
Experience communicating cross-functionally and drive external design house/supplier.
Design and simulate mixed-signal based ASICs optimized for depth sensors.
Improve the design quality, flow, processes for first time design success and high yield manufacturability (DFM).
Conduct research on topics/concepts in depth sensor IC development.
Support academic and industrial collaborations.
Ph.D in Physics, Electrical Engineering with 5+ years of industry experience in designing Analog and Mixed signal.
Experience in prototyping, characterization and debugging of image/depth sensor IC.
Familiar with CMOS image signal processing, imaging algorithms.
Understanding of mixed-signal building blocks (op-amps, filters, ADCs, DACs, output drivers), and PLL.
Knowledge of image/depth sensor IC fabrication processes and photonics physics.
Understanding fundamental of depth system, depth sensor operation, SPAD related technologies including PLL/DLL/TDC, and depth signal processing.
Experience in working with sensor vendors to drive the design reviews.
Hands-on experience on its layout review, understanding the digital design flow, and successfully drove multiple mixed signal chips into mass production.
Familiarity with low-power electronics/sensors/sensor-interface circuits.