Meta AR/VR Job | System Integration Engineer, Reality Labs
Job（岗位）: System Integration Engineer, Reality Labs
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2022-3-28
Summary（岗位介绍）
At Reality Labs, we aim to bring together the brightest cross-disciplinary minds in one place to deliver our mission: build tools that help people feel connected, anytime, anywhere. As a System Integration Engineer in the Wearables Team, you will design, build, and test prototype electrical systems for future consumer experiences within Meta’s Family of Products. You will become part of a team exploring new concepts through fast iterative prototyping. You will work cross-functionally with teams that will dynamically change depending on the problem and potentially include mechanical, optical, firmware, software, and research experts. We want people who work well in teams, can take a board definition and implement with electrical schematic and layout, and can transition these designs into a high-volume consumer product.
We’re looking for System Integration Engineers with experience in high volume consumer products. These systems will have custom ASICs, microcontrollers, microprocessors, FPGAs from simple to large, displays, audio, camera sensors, and high speed I/O. Familiarity with CAD tools like Cadence and OrCAD is required. The ideal candidate would be comfortable designing mixed high-speed digital circuit boards, be experienced troubleshooting at the board and system level, and be familiar with the consumer product development process.
Qualifications（岗位要求）
BS in Electrical Engineering or Computer Engineering, or equivalent experience
5+ years of experience in consumer electronics or related fields
Experience with schematic and board design using Cadence OrCAD, Altium or equivalent
Knowledge of the relationship between physical layout and electrical performance
Familiarity with consumer electronics product development lifecycle
Description（岗位职责）
Select major components, design, implement, debug and characterize embedded systems with end-to-end ownership of EE product design from concept to MP
Collaborate with system program management to assess and develop project schedule, milestones as well as identify risks and mitigation plans
Design schematics, drive board layouts, assembly, test, debug, and integrate designs into electro-mechanical systems
Collaborate with cross-functional teams to factor in product constraints in board level SiP designs
Drive resolution of technical issues by working with the cross-functional teams, such as, Mechanical, SW, Technology teams, Quality/Reliability, CM/JDM, and vendors
Work closely with CM/JDM resources to leverage their engineers and maximize the focus of internal resources on adding value to and differentiating our product
Additional Requirements（额外要求）
Experience in taking full ownership of board level SiP design from concept to production for one or more products
Expert in one or more subsystems in typical consumer electronics products such as camera, display, audio, SOC/Compute, sensors, power etc.
Demonstrated experience bringing new technologies and product categories to market
Experience with high speed signaling over DP, MIPI, HDMI, and USB SS
Consumer electronics experience and/or working within a mass production environment
