Meta AR/VR Job | Sensor Integration Engineer, Magnetometers
Citys（岗位城市）: Sunnyvale, CA | Redmond, WA
We are looking for a Sensor Integration Engineer that will partner with a team of professionals covering the complete AR/VR and wearable product development cycle to lead the requirements definition, selection, and integration of cutting-edge magnetometers into our products. We are looking for candidates with experience in magnetometer modeling, integration, characterization, calibration, and debug for high-volume consumer electronics products to assist with the development of novel hardware products.
BS degree in Electrical Engineering, Mechanical Engineering, or related engineering disciplines.
Demonstrated industry experience, directly contributing to product development or high-volume manufacturing of consumer electronics products.
Familiarity with integration of magnetometers into high-volume consumer electronics products, including an understanding of magnetic sensor modalities (Hall Effect, GMR, AMR), design and integration trade-offs, characterization and calibration techniques.
Hands-on experience in Finite Element Analysis of magnetic fields with COMSOL, ANSYS, or similar software packages and scripting in MATLAB or Python.
Interpersonal and cross-functional collaboration experience with internal and external partners.
Collaborate with other researchers and engineers across Facebook to develop novel hardware and software products that advance the state-of-the-art in AR/VR systems and wearables.
Collaborate with internal and external design, engineering, and validation teams to develop next generation sensor technologies.
Lead the requirements definition, selection, and integration of cutting-edge magnetometers and other advanced sensor technologies into our products.
Organize and lead design reviews, solution brainstorm sessions, and disseminate findings.
Work with the team to help design, set up, and run practical experiments related to sensor systems in AR/VR products and wearables.
MS degree in Electrical Engineering, Mechanical Engineering, or related engineering disciplines.
Experience in electronics packaging, PCBA mechanical design, electro-mechanical integration, and interconnects.
Demonstrated experience in Digital Signal Processing (DSP) techniques, such as digital filtering and sensor fusion.
Demonstrated experience in design and development of magnetometers.
Familiarity with the emerging Augmented Reality and Virtual Reality technologies.
High levels of creativity and quick problem-solving skills.