Meta AR/VR Job | Display Panel Design/Process Engineer
Job（岗位）: Display Panel Design/Process Engineer
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA | Redmond, WA
Date（发布日期）: 2022-2-17
Summary（岗位介绍）
The Reality Labs (RL) Platform Display and Optics (D&O) team focuses on moving the state-of-art display and optics technologies forward for Meta products, which gives people the power to build community and bring the world closer together. The team is responsible for the technology development and maturation, component design, manufacturing process advancement, and test & integration of display and optics module for all RL products.
As a Display Panel Design and Process engineer, you will be a member of our Display and Optics organization, taking a lead in display panel architecture to set the technical goals, lead the development of leading-edge technologies and designs, and work with the current and evolving ecosystem to provide differentiating capabilities to our HW platforms. You will be part of a group of highly talented engineers at the forefront of the innovation for AR/VR and portal products.
Qualifications（岗位要求）
3+ years of experience in the display and/or Silicon industry
Experience in panel architecture scoping and definition with various display technologies
Experience in characterizing panel optical and electrical performance
Experience in developing, designing and manufacturing high volume consumer product
Experience communicating with cross-functional partners and external vendors
Project management, communication skills and people skills
Description（岗位职责）
Lead engineering activities on advanced display design for new display applications
Work closely with cross functional teams and external display partners to develop the future display technologies and bring up design for new panel products
Resolve design and flow issues related with circuit and pixel design, identify potential solutions and drive execution
Work closely with display IC, panel and module vendors throughout the design, sample, and engineering validation phases to address any design, production, and quality issues
Partner with internal and external teams to develop uOLED displays based on silicon chips with specific process lines
Design and optimize uOLED circuit and layout within small pixel/cell pitch
Develop uOLED display silicon process and transfer existing silicon technologies into and out of various process lines
Process control monitor (PCM) statistical analysis to optimize device structure and process module
Design rule validation and optimization for uOLED display specifically silicon processes and devices
Support failure analysis to improve defect rate, yield and process quality
Willingness and ability for 30% International travel to Asia
Additional Requirements（额外要求）
M.S degree in Electrical Engineering, Material Science or Engineering, Physics or related
Hands-on skill on Pixel and panel design, layout, parasitic parameter extraction and panel modeling
Experience performing computer modeling and simulation with SPICE
Experience in display pixel, gate driver designs is preferred
Experience in characterizing panel optical and electrical performance is preferred
Hands-on experience with transistor level design and verification of key analog blocks, including ADC/DAC, PLL, LDO, temperature sensor, OPAMP
Experience with Cadence design environment and mixed-mode verification
Experience in CIS and low-noise analog design
Experience with high voltage or mixed-voltage analog IC design
Experience with block level and chip level analog layout
Expertise on analog layout platforms such as Cadence or Mentor and full set of layout verification tools including LVD/DRC checking tools
Knowledge of RC delay, IR drop, coupling capacitance, electromigration, ESD and latch up
Experience with design and evaluation of physical and electrical design rule test structures
Skills for computer tools: experience with layout edit software, experience with statistical data processing software, experience with device and process TCAD simulation tools
Knowledge of one or more of the following technologies: Bipolar, CMOS, Depletion MOS, CMOS Image Sensor (CIS), Non-Volatile Memory (NVM), High voltage CMOS
Back-end processing experience such as wafer dicing, wire bonding, etc.
