Meta AR/VR Job | Integration Electrical Engineer

Job（岗位）: Integration Electrical Engineer

Type（岗位类型）: Hardware

Citys（岗位城市）: Remote, US

Date（发布日期）: 2022-2-8

Summary（岗位介绍）

As a DFM Engineer at Reality Labs you will partner with internal design teams from early conceptualization and development of high fidelity prototypes to deliver high volume consumer products. As an integral member of the core development team that bridges the space between one-off Product Engineering prototypes and manufacturing partners, your responsibilities will help shape the future success of our products. Your role will collaborate cross-functionally within the engineering community such as EE, ME, MFG, RE and test disciplines.

This position will have the opportunity to influence product design decisions, own a substantial aspect of our scaled manufacturing builds, and develop processes with line-of-sight to mass production. The ideal candidate has demonstrated ability to collaborate with internal design teams and external production partners. More so, we are seeking experienced engineers that have demonstrated success navigating through the development and execution of end-to-end manufacturing processes in support of new opto-mechanical products. The candidate will also have a strong ability to communicate to all levels of an organization – from management and higher-level strategy planning to the technicians and leads on a manufacturing floor.

Qualifications（岗位要求）

Bachelor of Science in Electrical or Mechanical Engineering, M.S. in related engineering discipline or equivalent experience

5+ years industry experience directly contributing to product development or high-volume manufacturing process engineering involving printed circuit board assembly (Board Fab, SMT, through-hole, pin-in-paste), Rigid Flexible Printed Circuits, Flexible Printed Circuits, and mechanical systems integration within a concurrent environment

Experience with process bring-up, fabrication and design optimization

Experience with communication skills, problem-solving, presenting data

Experience with PCBA and product level failure modes (production and field)

Experience with relating failure mode to process, material and design related stressors

Experience with mass production in domestic and overseas manufacturing on consumer products and management of external vendor to deliver on schedule

Experience with DFM related to printed circuit board assemblies (PCBA), Rigid and Flexible Printed Circuits (RFPC/FPC), and manufacturing processes, inspection and validation

Experience in product/process characterization using techniques such as FEA, strain analysis, cost modeling, yield and defect data analysis

Experience in Printed Circuit Board layout or fabrication experience/knowledge, proficiency with PCB CAD layout and/or viewing software

Experience with industry standards (IPC, JEDEC, IEEE, EIA, etc.)

Experience with Geometric Dimensioning and Tolerancing (GD&T) and 2D/3D tolerance analyses

Description（岗位职责）

Work with the hardware engineering team to understand product design intent and be the driver for manufacturability of PCBA, RFPC, FPCs and interconnect requirements for small-scale manufacturing through high volume production handoff.

Function as an expert in Design for Manufacturability (DFM) methods, best practices and establishment of design rules.

The position requires a strong technical aptitude including an excellent understanding of DfX methodologies, high volume electronics manufacturing processes, printed circuit board technology, component selection, test and inspection methodologies, quality assurance and consumer electronics product development.

The successful candidate will be able to draw from industry experience to provide technical guidance, perform physical and statistical analysis, recommend and prepare design-of-experiments, characterize process/design interactions, review component and product design specifications, analyze mechanical and electrical design information and draft/edit specifications and technical guidelines.

Lead board Fabrication activities, including work with rigid PCB, flexible PCB, and rigid flex fab vendors to understand their technology roadmaps, design rules and processes to support NPI as well as production projects, work with the internal CAD team to help define the design rules and constraints for PCB layout, support internal engineering teams for DFM checks and DFM review, and work with fab vendors to generate PCB panel fabrication drawings for designs.

Lead board assembly activities.

Guide and support internal CAD and engineering teams on design constraints (including standardizing and maintaining footprint designs for rigid boards as well as LPI and coverlay-defined flexible PCBs, setting spacing rules, solder paste data, SMD vs NSMD pads) to optimize for production yield and cost. Examples may include EMI shields, speaker jacks and other electro-mechanical components.

Drive contract manufacturers to define the requirements for their SMT process. Examples may include PoP memory assembly process definition and process flow.

Support mass production projects and work with the contract manufacturers to improve their SMT process and optimize for better yield and lower cost. Examples may include reviewing reflow oven temperature profiles, stencil designs, solder paste inspection process and AOI.

Work with contract manufacturers to root-cause failures and process issues during builds, utilizing 5D-Xray, CT scan and other failure analysis tools.

Provide feedback and learnings to internal CAD and engineering teams to improve future designs and processes.

Guide the integration of product elements to achieve optimized designs. As an expert in these areas, you will work with external partners to improve designs, define processes, and develop equipment to manufacture and verify industry leading products.

Lead design review activities including: DFM reviews, Failure Modes and Effect Analyses (FMEA) for Design and Processes, and Process Feasibility Reviews.

Manage internal and external partner teams in the execution of process design, experimentation, and bring-up.

Evaluate prospective vendors (CM, Supply Chain) for process and quality capability based on project needs.

Willingness to travel domestically and internationally.

Additional Requirements（额外要求）

Experience with design for six sigma, inclusive of structure problem solving approach, design experimentation and optimization (DOE), root cause and defect/failure analysis, FMEA, FEA, reliability testing, statistical data analysis, manufacturing process knowledge (MSA/GRR)

Experience with electro-mechanical design, material selection, design for EMI/RF, antennae design and system integration

Experience with statistical analysis, including usage of tools such as JMP and Minitab

Experience with 3D design tools, FEA, and other CAD suites

Experience with mechanical tolerance analysis and tools such as CETOL and VSA

Experience with high speed automation, mechanized assembly, and testing for high volume products

Experience with industry consortiums such as IPC and iNEMI

Experience working with reliability and/or quality engineering