Apple AR/VR Job | Camera Depth Module Engineer
Job（岗位）: Camera Depth Module Engineer
Citys（岗位城市）: Santa Clara Valley (Cupertino), California, United States
Date（发布日期）: 2023-12-6
Summary（岗位介绍）
Do you love taking on big challenges that require exceptionally creative solutions? Do you deeply understand how an incredible camera experience should work? As part of our Camera Technologies group, you’ll help design the innovative technology that allows each generation of Apple products to produce photos even more incredible than the last. You’ll design and develop groundbreaking ideas for everything involved in our camera systems, from sensor to lens. You’ll collaborate with teams across Apple to research, design, develop, test, and qualify camera hardware for Apple products. Together, we’ll craft a magical photography experience that redefines what millions of customers can expect from their cameras.
The Depth sensing team at Apple develops depth-sensing hardware such as the revolutionary TrueDepth camera that powers FaceID and cutting edge LiDAR scanner. This multi-disciplinary group of engineers is responsible for architecture, research, and manufacturing development of these highly complex sensing systems for Apple products focusing on wearables for the Vision Product line including the Vision Pro. We are seeking a Depth Module Design Lead to lead development of Depth HW modules in engagements with product and technology teams.
The primary responsibility for this role is to integrate depth sensing module into Apple wearable products, meet the performance requirements both for the module and system constrains. Heavy interaction with multidisciplinary Apple and vendor teams (electrical, mechanical, process, test, firmware, software and operations) requires the ability to understand a wide breadth of engineering and technical principles. Responsibilities include:
Qualifications（岗位要求）
Ability to lead cross-functional teams and take responsibility for project success. The ideal candidate will have deep expertise in hardware design, new product development from concept to mass production, leading cross-functional, diverse team(s) of scientists and engineers.
Strong written and verbal communication skills
Additional experience in at least 1-2 of the skills listed below are highly desired:
Depth sensor design, characterization, testing
Mechanical Design of assemblies for high volume manufacturing
Electronic circuit design: Digital, power-supply, & analog
Optical design of compact imaging optics
Data analysis and statistics using MATLAB or JMP
Manufacturing processes for high-precision, high-volume modules
Laser and/or photonics integrated circuit design, fabrication, testing
Description（岗位职责）
– Define, document and validate system integration requirements for compact depth sensing module in Apple product
– Leadership of international manufacturing partners for module in system evaluation, prototype builds, and qualification.
– Leadership of depth module focused test definition and validation at manufacturing sites and in Apple lab.
– Detailed failure analysis of any issues affecting functionality and performance of module in Apple product
– Reporting to executive and cross-functional teams on development status of module integration.
Additional Requirements（额外要求）
Ability to travel internationally to Asia/Europe to suppliers for support and FA (typically 20%).
