Meta AR/VR Job | Thermal Research Engineer
Job（岗位）: Thermal Research Engineer
Type（岗位类型）: Artificial Intelligence
Citys（岗位城市）: Redmond, WA
We are looking for a skilled and motivated Thermal Research Engineer to join our team. We are specifically seeking a candidate to lead projects to develop thermal management solutions for next generation XR devices, from concept to advanced prototypes suitable for product integration. Key responsibilities include defining and driving a thermal management research direction, leading research and development projects, including engagements with academic and industrial research and manufacturing partners, and performing thermal modeling and analysis using FEA and CFD tools. The chosen candidate will work with a diverse and highly interdisciplinary team of researchers and engineers and will have access to innovative technology, resources, and testing facilities.
Bachelor’s degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.
Currently has, or is in the process of obtaining, a BS degree in Physics, Aerospace Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or similar discipline, relevant technical field, or equivalent practical experience. Degree must be completed prior to joining Meta.
3+ years experience with project leadership in a research or advanced product development environment
5+ years experience with FEA, CFD (COMSOL, ANSYS, FloEFD) and CAD (Solidworks, CREO, NX) or similar tools
5+ years experience with system and/or sub-system thermal simulation, analysis, and solution development, from concept to production, for high volume consumer electronics devices
Experience with rapid prototyping and high-volume manufacturing methods
Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment
Define and drive a thermal management research direction
lead a team of researchers and engineers to develop novel thermal management solutions for next generation XR devices, from concept to advanced prototypes suitable for product integration
Develop relationships, scope and lead engagements with academic and industrial research and manufacturing partners
Develop thermal FEA and CFD models and run simulations using Ansys, COMSOL, or similar software
Interpret simulation results and provide physical explanations and possible solutions to problems
Develop thermal test beds, data acquisition systems, and processes to characterize thermal management materials, devices, and systems
Run experiments, analyze data, document results, and present conclusions and recommendations in research meetings.
Recommend design changes/directions to meet device performance requirements, participate in team brainstorming and new technology development
MS/PhD in Physics, Aerospace Engineering, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, or similar discipline.
Experience with thermal design of printed circuit boards, flex circuits, thermal interface materials, digital chips/device, heatsinks and other active/passive cooling solutions
Experience developing passive thermal management solutions using compliant materials such as aerogels, graphite heat spreaders, phase change materials, metamaterials, radiation coatings
Experience developing relationships, scoping and lead engagements with academic and industrial research and manufacturing partners (OEMs, CMs)
Experience with bioheat transfer (e.g., Pennes Bio-Heat equation) and thermal management for wearables, including moisture/humidity simulation and analysis