Meta AR/VR Job | Lead Depth Sensor Engineer
Job（岗位）: Lead Depth Sensor Engineer
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2023-9-2
Summary（岗位介绍）
Reality Labs is a world leader in the design of augmented reality (AR) and virtual reality (VR) systems. Come work alongside technology visionaries and research scientists to create the technology that makes AR/VR pervasive and universal. The sensors team within our Technology Engineering for Devices organization gathers world class expertise and talent in photographic, machine perception imaging sensors, depth, inertial, and bio sensing systems, and owns the development and validation for all these sensing systems across Meta’s AR/VR & wearable product portfolio.
We’re looking to hire a Lead Depth Sensor Engineer with a blend of systems skills and a background on depth and image sensor architectures and development. The ideal candidate would have experience driving architecture convergence on complex consumer electronics products with experience with silicon definition and evaluation, depth systems understanding, and the ability to work collaboratively with experts in different fields to make architectural tradeoffs for definition, selection and integration of leading edge depth sensors into our product depth modules. In addition, we’re seeking someone with experience that span across off-the-shelf (OTS) sensors, semi-custom sensors, fully custom sensors, and advanced sensor technologies.
Qualifications（岗位要求）
BS in Electrical Engineering or Physics, or equivalent industry experience
Experience translating system requirements into sensor specifications and down select sensors for products (electrical, optical, sensor etc.)
8+ years of industry experience in depth and/or image sensor silicon systems
Experience working with internal cross functional teams (including product managers, system HW/SW engineers, sourcing team, etc) and external technical partners
Knowledge of depth sensor block and top level design: pixels, analogue readout, TDC and serial interfaces. Knowledge of depth sensor operation and performance tradeoff in the depth system
Experience in Characterization, Validation, Debugging of depth performance for iToF or dToF sensor
Description（岗位职责）
Lead the definition of end-to-end depth sensor architectures in collaboration with silicon, optics, illuminator, hardware and software platform and experiences for the next generation of AR/VR devices and products
Define sensor specification, drive the technical scoping and development (OTS and custom-design solutions), deliver high volume, high quality depth sensor for AR/VR products on the roadmap
Conduct review and trade-off studies for complex depth integrated circuit development
Engage with vendors in evaluate their technology capability, influence their product and RnD roadmaps, identify opportunity for deeper collaboration
Works with other teams to define mid/long term strategy on depth sensor development, influencing team’s key investment by communicating it effectively to both internal and external stakeholders
Additional Requirements（额外要求）
Understanding of sensor silicon design and manufacturing flow, and track record of driving complex consumer electronics projects from specification definition to mass production
PhD in Electrical Engineering or Physics, or equivalent industry experience
Experience with SPAD-based technologies, depth sensor operation, the depth and image sensors and post-processing. Knowledge of major SOC platforms, computer vision, or machine learning
Proficiency with data collection and analysis tools, including scripting languages such as C/C++, Python, and MATLAB
Experience with depth module specifications, including their subcomponents, such as DOE (Diffractive Optical Elements), VCSEL, VCSEL driver, and PMU (Power Management Units)
