Meta AR/VR Job | Optoelectronic Packaging Research Scientist
Job（岗位）: Optoelectronic Packaging Research Scientist
Citys（岗位城市）: Redmond, WA
At Meta’s Reality Labs Research, our goal is to make world-class consumer virtual, augmented, and mixed reality experiences. Come work alongside industry-leading scientists and engineers to create the technology that makes VR and AR pervasive and universal. Join the adventure of a lifetime as we make science fiction real and change the world. We are currently seeking innovative scientists with experience designing, modeling, and prototyping advanced optical systems for near-to-eye display applications. This is a full-time position and requires an advanced degree in Optical Engineering, Physics, Electrical Engineering or similar field, and a strong background in optoelectronic packaging solutions. Successful candidates must be comfortable working in a dynamic cross-functional team.
PhD degree or equivalent experience in Laser Packaging, Material Science, Physics, Electrical Engineering, Optical Engineering, or a related field.
5+ years of experience working on Semiconductor Laser or related Optoelectronic Device packaging experience.
5+ years experience in custom optoelectronic packaging, optomechanical design, assembly process, and test methods.
Hands-on experience of developing and troubleshooting laser diode or other optoelectronic device packaging and integration processes.
Experience in simulation of package designs to verify performance and integrity over thermal and mechanical stresses.
Design and develop novel opto-electronic packaging solutions for use in AR/VR displays.
Develop custom assembly processes for semiconductor laser packaging.
Model, simulate, and validate experimental package designs to verify performance and integrity over thermal and mechanical stresses.
Create and implement new design testing methods and procedures.
Collaborate with semiconductor chip designers, test and reliability engineers, and process engineers to design for optimal device performance, manufacturability, and reliability.
Take leadership in identifying technologies and processes, managing internal and external investigations, and selecting technical pathways to support evolving program needs.
Expertise in designing and commercializing Active Opto-Electronics Components.
Knowledge of commonly-used conventional as well as advanced packaging materials.
Knowledge of laser diode manufacturing methods on wafer and chip level as they relate to packaging and system integration.
Knowledge of laser diode operational characteristics as well as degradation mechanisms.
Experience working effectively with cross-site & cross-functional teams.
Experience and understanding of optical and RF interfaces.