Meta AR/VR Job | Thermomechanical Packaging Engineer | Oculus

Job(岗位): Thermomechanical Packaging Engineer | Oculus

Type(岗位类型): Hardware

Citys(岗位城市): Sunnyvale, CA | Redmond, WA

Date(发布日期): 2023-1-13


Reality Labs (RL) brings together world-class experts to develop and ship groundbreaking products at the intersection of hardware, software, and content. We build seemingly impossible products that define new categories that advance Meta’s mission of connecting the world. This team has the responsibility for making breakthroughs and delivering them to market at scale. The Applied Materials team at Reality Labs seeks a Thermomechanical Packaging Engineer with the ability to work on groundbreaking thermal solutions for AR and VR devices.


B.S. in Mechanical Engineering, Applied Physics or other relevant degree.

5+ years of experience with thermal characterization of hardware in electronic packaging space.

Experience in a lab environment – proficient with hands-on lab work and logistics.

Solid thermal background – experience with all modes of heat transfer.

Knowledge of heatsinks, graphites, TIMS, fan/blowers, and advanced thermal solutions.

Experience in thermal design of PCB and PCBA constituents.

Knowledge of thermography and in-situ thermal characterization.

Familiar with metrology tools used for thermal and mechanical measurements.

Experience using an analytical approach and driving projects to closure.


Understand thermal management systems in Reality Labs’ product roadmap and identify risks and opportunities.

Develop and qualify advanced thermal management solution-sets using novel technologies, either in-house or in collaboration with suppliers.

Determine performance KPIs – outline test plan and execution to hit design targets.

Build test rigs to help qualify above solution-sets from CAD/concept to final set up.

Characterize thermal, mechanical, and electrical properties of advanced thermal technologies for cooling consumer electronics.

Work with cross-functional partners, providing guidance, recommendations and next steps and manage work streams across different geographies.

Identify process windows and seamlessly transition technology from development to high volume production.

Present regular updates on learnings and results to internal/external teams and bring to teams to consensus.

Additional Requirements(额外要求)

M.S. or Ph.D. in Mechanical Engineering, Applied Physics or other relevant discipline.

10+ years of experience with thermal characterization of hardware packaging, heat sinks and cooling solutions.

Knowledge of CAD, fixture design, machine shop capabilities, and manufacturing processes.

Familiarity with thermal software tools (Icepak, Flotherm).

Knowledge of JMP and MINITAB.