Meta AR/VR Job | Research Scientist Intern, Device Research (PhD)
Type（岗位类型）: Computer Vision | Research
Citys（岗位城市）: Redmond, WA
Meta Reality Labs Redmond is looking for exceptional interns to help create the next generation of virtual and augmented reality. Our research focuses on comprehensive solutions to complex tracking problems, delivering novel technologies and algorithms fundamental to future VR and AR systems. You’ll have the unique opportunity to work with industry-leading researchers and engineers who are defining the future of VR.
In particular, Meta Reality Labs Research is looking for motivated interns for device research in eye tracking applications. This internship project involves detailed electrical/mechanical modeling, package modeling, design of the MEMS scanner for the next-gen eye-tracking and steering display technologies. The MEMS type would include optical micromirror, optical mirror array, and acoustic MEMS devices. Scope of the project includes modeling and optimization of the stress level/aperture size/overall chip size of the MEMS device.
Our internships are twelve (12) to sixteen (16) to twenty-four (24) weeks long and we have various start dates throughout the year.
Currently has, or is in the process of obtaining, a Ph.D. degree in the fields of applied mathematic, signal processing, computational optics, or related fields
Experience coding in MATLAB and/or Python
Experience with data acquisition hardware and signal processing chains and Experience with MEMS layout tools
Interpersonal experience: cross-group and cross-culture collaboration
Must obtain work authorization in country of employment at the time of hire, and maintain ongoing work authorization during employment
Develop next generation MEMS device architectures and specifications
Participate in developing processes for our MEMS device including materials research, planning, executing, analyzing, and optimizing
Mechanical & electrical analytical modeling of MEMS and IC components using Matlab/Simulink or equivalent tools
Mechanical FEM modeling of MEMS components using ANSYS
Perform package modeling for MEMS sensors using finite element modeling
Innovations on MEMS design/process and document invention disclosures leading to patents for new devices
Perform bench level testing and debugging of new MEMS devices
Support testing flow development
Documents details about analyses, design, and testing methodologies
Hands-on cleanroom experience in MEMS or semiconductor process development
Experience in MEMS foundry process and engagement
Thorough understanding of electrostatic actuators and capacitive/resistive sensing
Ability to debug and characterize analog systems using LDV, oscilloscopes etc.
Experience with MEMS reliability testing including fatigue/stress/temperature/shocking testing
Experience with MEMS packaging
Experience with mechanical CAD tools such as SolidWorks/AutoCAD
Experience with geometric optics, imaging optics
Intent to return to a degree program after the completion of the internship
Proven track record of achieving significant results as demonstrated by grants, fellowships, patents, as well as first-authored publications at leading workshops or conferences such as SPIE, ETRA, OSA, IEEE, CVPR, ICCV, SIGGRAPH