Meta AR/VR Job | Silicon Package Development Engineer
Job（岗位）: Silicon Package Development Engineer
Type（岗位类型）: Hardware
Citys（岗位城市）: Remote, US | Sunnyvale, CA
Date（发布日期）: 2022-8-24
Summary（岗位介绍）
Meta Reality Labs focuses on delivering Meta’s vision through Augmented Reality (AR) and Virtual Reality (VR). The compute performance and power efficiency requirements of Virtual and Augmented Reality require custom silicon. Meta Silicon team is driving the state of the art forward with breakthrough work in computer vision, machine learning, mixed reality, graphics, displays, sensors, and new ways to map the human body. Our chips will enable AR and VR devices where our real and virtual world will mix and match throughout the day. We believe the only way to achieve our goals is to look at the entire stack, from transistor, through architecture, to firmware and algorithms. Join the adventure of a lifetime as we make science fiction real and change the world.
We are seeking a Silicon Package Development Engineer to join our silicon team. We are building a competency in Packaging technology to support the development of custom Si for AR/VR hardware as well as to develop Packaging solutions that are optimal for our device ID and system level performance.
Qualifications（岗位要求）
Experience taking products from concept to production including development of manufacturing specifications, vendor qualifications and improvement of manufacturing efficiencies and costs.
5+ years experience in advanced Si package and SiP module development and manufacturing.
Bachelors degree in materials science, mechanical engineering, electrical engineering or equivalent experience.
Description（岗位职责）
Develop and qualify packaging for Meta’s custom silicon with configurations ranging from single-chip, module, SiP and processor-memory integration as well as downstream board and system level assembly.
Develop manufacturing specifications and qualification plans working with other stakeholders in Meta.
Work closely with internal silicon, architecture and system teams and externally engaged partners, design houses and OSAT companies to develop package architecture, performance/reliability requirements and manufacturing specifications.
Additional Requirements（额外要求）
Familiarity with package electrical fundamentals like SI-PI and PDN
Masters degree in Electrical or Mechanical Engineering, Material Science or equivalent
Familiarity with advanced SiP module design, development and manufacturing
Familiarity with FEM modeling of package thermal and mechanical behavior
Familiarity with risk assessment and mitigation methodologies like FMEA and DFM
