Meta AR/VR Job | Product Design Engineer – Sensor & Package Design | Oculus

Job(岗位): Product Design Engineer – Sensor & Package Design | Oculus

Type(岗位类型): Engineering

Citys(岗位城市): Sunnyvale, CA

Date(发布日期): 2022-4-28

Summary(岗位介绍)

The Reality Labs team at Meta is helping more people around the world come together and connect through world-class AR/VR hardware and software. With global teams dedicated to AR/VR research, computer vision, haptics, social interaction, and more, Meta is committed to driving the state-of-the-art forward through relentless innovation. The potential of AR/VR to change the world is immense and we’re just getting started.

Our Technology Engineering for Devices (TED) team explores, develops, and delivers new cutting-edge technologies that serve as the foundation of current and future Meta products. From mixed reality and human interaction to natural inputs and beyond, TED is focused on transforming new technologies from early concept to product by iterating, prototyping, and realizing the human value and new experiences these technologies enable.

The Depth HW team within TED develops high-performance depth solutions for RL’s AR/VR products. This multidisciplinary group brings research to life by realizing state-of-the-art custom modules including ASICs, lasers, optics, firmware etc. We are seeking a sensor Product Design Engineer for end-to-end ownership of laser based optical modules from initial design to high volume delivery.

We are seeking a sensor Product Design Engineer who has a passion for working across disciplines to transform research technologies into physical solutions.

Qualifications(岗位要求)

BS in Mechanical Engineering or related field or equivalent practical experience

3+ years in package engineering development or equivalent experience

Knowledge of packaging material characteristic, behavior, and performance

Knowledge of material properties such as plastics, metal, adhesive, glass, PCBA, and flex circuit

Knowledge and application of GD&T techniques and knowledge of associated metrology approaches

Knowledge in mechanical design fundamentals for typical consumer electronics design (injection molding, stamping, casting, MIM, machining, etc.)

Experience in 3D design modeling (NX, SolidWorks, or Creo) and physical prototyping

Experience mentoring others, leading by example, and elevating the engineering excellence of your team

Description(岗位职责)

Drive development of optical sensor requirements for advanced imaging and depth system technologies

Drive roadmap for sensor integration into system, components, manufacturing processes

Collaborate closely with the industrial design and the supply chain NPI teams

Model, build, test, and refine packaging prototypes, fixtures and characterization test systems

Work across the full product development cycle, from concept inception to integration to shipping products

Work with vendors worldwide to push state-of-the-art technologies and approaches to solving complex mechanical problems

Support development of advanced sensor chip packaging solutions for modules

Drive electromechanical packaging testing, failure analysis and provide recommendations

Manage packaging drawings, assembly specs, SOPs and documentation

Additional Requirements(额外要求)

MS or PhD Mechanical Engineering or related degree

5+ years of opto-mechanical experience for high volume products

Experience delivering world-class packaging solutions for leading consumer electronics brands

Knowledge of optics component mounting, interfaces, and adhesive bonding

Knowledge or optics manufacturing techniques (glass lens, plastic lens, coatings, molding)

Experience in consumer electronics product development and/or manufacturing

Experience with mass production of systems requiring active optical alignment

Experience delivering multiple successful consumer products to production from concept inception to shipping product

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