Meta AR/VR Job | Wireless Silicon Architect | Oculus

Job(岗位): Wireless Silicon Architect | Oculus

Type(岗位类型): Engineering | Hardware

Citys(岗位城市): Remote, US | Sunnyvale, CA | Redmond, WA

Date(发布日期): 2022-3-16

Summary(岗位介绍)

AR/VR Wireless Team focuses on delivering Meta’s vision through Augmented Reality (AR). Compute power requirements of Augmented Reality require custom silicon. Our Wireless team is driving the state-of-the-art forward with breakthrough work in computer vision, machine learning, mixed reality, graphics, displays, sensors, and new ways to map the human body. Our chips will enable AR devices where our real and virtual worlds will mix and match throughout the day. We believe the only way to achieve our goals is to look at the entire stack, from transistor, through architecture, to firmware, and algorithms.

The wireless development team focuses on delivering Meta’s mission through a series of Virtual Reality (VR) and Augmented Reality (AR) products. We are seeking an experienced wireless silicon architect to support the development of wireless links required in AR/VR products. In this role, you will be a key member of a team of innovators, working on leading-edge wireless technologies and developing chips to enable the future of AR/VR.

Qualifications(岗位要求)

Bachelor’s degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.

MS in Electrical or Computer Engineering

8+ years wireless (WiFi/BT) chip architecture and design experience

Low power design and power management methodology experience

Experience MAC to SoC interfaces, throughput modeling, and data-flows

Wireless subsystem integration experience

Knowledge with MAC/PHY/SoC DV methodology

Experience with wireless silicon performance and parametric testing in lab environment

Description(岗位职责)

Support internal and external wireless silicon development activity for AR/VR

Collaborate with systems, RF, and product management teams to define wireless silicon chips that meet AR/VR product requirements

Analyze product use cases and define wireless subsystem performance requirements such as throughput, latency, and power

Collaborate with chip development teams on wireless and SoC chip-set architecture, including hardware/software partitioning and wireless subsystem control features and data-flows

Collaborate with software team on features for MAC and power management

Ensure correct interfaces, throughput, power management, and coexistence features on SoCs to support wireless links

Partner with external chip providers to ensure successful wireless chip development, including review and management of manufacturing qualification, verification, and validation plans

Contribute to wireless silicon lab validation

Additional Requirements(额外要求)

Familiarity with MAC-PHY interface design

Familiarity with PHY/RF performance analysis/metrics

Understanding of chip manufacturing package and qualification issues

Understanding of and experience with wireless technologies and standards, including WiFi (11ac, 11ax), WiGig (11ad, 11ay), Bluetooth, and cellular LTE/5G

Experience with cellular modem integration issues and performance validation

Strong communication and collaboration skills, with experience to effectively lead technical initiatives cross-functionally

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