Meta AR/VR Job | System in Package (SiP) Engineer | Oculus
Job（岗位）: System in Package (SiP) Engineer | Oculus
Type（岗位类型）: Hardware | Operations, Partner Engineering, Partnerships, Product Strategy, Program Management
Citys（岗位城市）: Sunnyvale, CA
Date（发布日期）: 2022-2-14
Summary（岗位介绍）
The Reality Lab in Meta is building products that make it easier for people to connect with the ones they love most. We are a team of world-class experts developing and shipping products at the intersection of hardware, software, and content. We are seeking an engineer who has experience in building System in package (SiP) or System in Module for space constrained consumer electronics and battery operated mobile products. In this role, you will be responsible for SiP manufacturing design and development to solve complex problems that directly impact final product quality, cost and delivery of Meta AR/VR products. You will define and implement manufacturing process best practices to the design of our products. You will be a key member of the Technical Operations team and will partner closely with Hardware Engineering, Quality, Test Engineering and our Manufacturing partners providing early and on-going manufacturing involvement to ensure new products are manufacturable from concept to mass production and through the end of life.
Qualifications（岗位要求）
BS or MS in Materials Sciences, Electrical Engineering or related fields or equivalent experience.
5+ years of experience in consumer electronics, silicon packaging or related fields.
2+ years of experience in building and integrating System in Module or System in Package for space constrained products.
Experience with SiP module, SMT, molding, singulation, advanced printed circuit board (PCB) technologies, advanced manufacturing processes and packaging technologies.
Experience with leading technical teams, cross-functional groups and external vendors against plans.
Description（岗位职责）
Explore, develop and deploy system in package module technologies in high volume manufacturing.
Define substrate stackup, placement, materials, process flow, test vehicle(s), and test/validation methodology to build a reliable SiP module for mass production.
Interface with vendors and suppliers and collaborate with internal cross functional teams to develop new technologies needed to build world class and cost effective SiP modules.
Collaborate with module/technology teams and create validation plans to characterize SiP performance and system co-existence testing.
Drive the resolution of SiP related technical issue by collaborating with internal and external partners leveraging physical analysis, surface analysis, structural analysis, and functional debug.
Support technical program manager in planning, executing, and tracking progress of complex process or product development and regular updates to management on program status.
Additional Requirements（额外要求）
Experience with bringing new technologies to production.
Experience with characterization and statistical data analysis.
Experience with silicon packaging technologies and packaging trends.
Experience with understanding the relationship between physical layout and electrical performance.
