Meta AR/VR Job | Packaging Engineer

Job(岗位): Packaging Engineer

Type(岗位类型): Hardware

Citys(岗位城市): Sunnyvale, CA | Seattle, WA

Date(发布日期): 2022-1-25

Summary(岗位介绍)

The mission of the Packaging Engineering team is to develop and launch world-class packaging to support Reality Labs hardware. We work closely with a wide array of creative, technical and operations partners as we push the boundaries of what is possible.

As a Packaging Engineer you’ll provide engineering support for all packaging development activity across Reality Labs hardware portfolio. This includes realizing your packaging concepts through the entire design process – working closely with Industrial Design, Manufacturing, Supply Chain and Operations to prototype and deliver packaging solutions.

Qualifications(岗位要求)

Bachelor’s degree in Mechanical Engineering, Packaging Engineering, Packaging Science or equivalent experience

3+ years in package engineering development or equivalent experience

Knowledge of shock, vibration, and the effect of temperature variation in product protection and package design

Experience in the following manufacturing/material processes: Rigid Box, Paper Pulp Molded Fiber, Thermoforming, Corrugated, Labels, Foam, Shrink Wrap, Films, Adhesives

Knowledge of packaging manufacturing, printing, and production processes

Knowledge of statistics, process controls and tolerance analysis

2D and 3D CAD experience, (i.e. ArtiosCAD, Solidworks, Siemens NX, SolidWorks)

Experience in ArtiosCAD, CAPE/TOPS, or similar software

Knowledge of packaging material characteristic, behavior, and performance

Description(岗位职责)

Work closely with ID, HW, Ops, and Program Managers to provide engineering support for all packaging development activity

Provide engineering evaluation of packaging concepts throughout preliminary design stage

Partner with marketing and ID teams to inform CMF and component level material spec

Own engineering development and execution of final packaging design concepts

Own DFMEA and develop offline tests/DOE to explore innovation, evaluate manufacturability and support HW builds

Assist in directing packaging vendors and internal partners to realize packaging solutions. Champion FRL quality objectives and ensure adherence to spec

Drive package reliability execution and provide analysis of test results, troubleshoot and partner with ID team to develop viable solutions

Troubleshoot packaging reliability failures (HW cosmetic, package structure, fit/function) and partner closely with internal teams and suppliers to provide swift resolution

Provide on-site support for manufacturing builds across major product launches, owning OK 2 Ship from Packaging vendors to Contract manufacturers

Manage Packaging drawings, assembly specs, SOPs and documentation

Provide cost feasibility, aligning with GSM cost targets

Provide technical support to all engineering/manufacturing entities in implementing processes for product packaging

Work closely with Package Ops to ensure smooth deployment of packaging structure at FATP

Contribute to upstream package development initiatives, providing insight into latest manufacturing and material technologies

Assist with on-site package prototyping as required

Additional Requirements(额外要求)

Experience delivering world-class packaging solutions for leading consumer electronics brands

5+ years in package engineering development or equivalent experience

Experience with Chinese language, Mandarin or Cantonese

Experience with using Zund/Kongsberg digital cutter

Experience with PLM & NX/Teamcenter

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