Meta AR/VR Job | Packaging Engineer
Job（岗位）: Packaging Engineer
Type（岗位类型）: Hardware
Citys（岗位城市）: Sunnyvale, CA | Seattle, WA
Date（发布日期）: 2022-1-25
Summary（岗位介绍）
The mission of the Packaging Engineering team is to develop and launch world-class packaging to support Reality Labs hardware. We work closely with a wide array of creative, technical and operations partners as we push the boundaries of what is possible.
As a Packaging Engineer you’ll provide engineering support for all packaging development activity across Reality Labs hardware portfolio. This includes realizing your packaging concepts through the entire design process – working closely with Industrial Design, Manufacturing, Supply Chain and Operations to prototype and deliver packaging solutions.
Qualifications（岗位要求）
Bachelor’s degree in Mechanical Engineering, Packaging Engineering, Packaging Science or equivalent experience
3+ years in package engineering development or equivalent experience
Knowledge of shock, vibration, and the effect of temperature variation in product protection and package design
Experience in the following manufacturing/material processes: Rigid Box, Paper Pulp Molded Fiber, Thermoforming, Corrugated, Labels, Foam, Shrink Wrap, Films, Adhesives
Knowledge of packaging manufacturing, printing, and production processes
Knowledge of statistics, process controls and tolerance analysis
2D and 3D CAD experience, (i.e. ArtiosCAD, Solidworks, Siemens NX, SolidWorks)
Experience in ArtiosCAD, CAPE/TOPS, or similar software
Knowledge of packaging material characteristic, behavior, and performance
Description（岗位职责）
Work closely with ID, HW, Ops, and Program Managers to provide engineering support for all packaging development activity
Provide engineering evaluation of packaging concepts throughout preliminary design stage
Partner with marketing and ID teams to inform CMF and component level material spec
Own engineering development and execution of final packaging design concepts
Own DFMEA and develop offline tests/DOE to explore innovation, evaluate manufacturability and support HW builds
Assist in directing packaging vendors and internal partners to realize packaging solutions. Champion FRL quality objectives and ensure adherence to spec
Drive package reliability execution and provide analysis of test results, troubleshoot and partner with ID team to develop viable solutions
Troubleshoot packaging reliability failures (HW cosmetic, package structure, fit/function) and partner closely with internal teams and suppliers to provide swift resolution
Provide on-site support for manufacturing builds across major product launches, owning OK 2 Ship from Packaging vendors to Contract manufacturers
Manage Packaging drawings, assembly specs, SOPs and documentation
Provide cost feasibility, aligning with GSM cost targets
Provide technical support to all engineering/manufacturing entities in implementing processes for product packaging
Work closely with Package Ops to ensure smooth deployment of packaging structure at FATP
Contribute to upstream package development initiatives, providing insight into latest manufacturing and material technologies
Assist with on-site package prototyping as required
Additional Requirements（额外要求）
Experience delivering world-class packaging solutions for leading consumer electronics brands
5+ years in package engineering development or equivalent experience
Experience with Chinese language, Mandarin or Cantonese
Experience with using Zund/Kongsberg digital cutter
Experience with PLM & NX/Teamcenter
